BS EN 60191-6-12:2011
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
Hardcopy , PDF
English
31-08-2011
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1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Gives standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 02/204115 DC (10/2002) Supersedes 10/30215537 DC. (08/2011)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: \'Rectangular type\' has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.
| Standards | Relationship |
| EN 60191-6-12:2011 | Identical |
| NF EN 60191-6-12 : 2012 | Identical |
| IEC 60191-6-12:2011 | Identical |
| DIN EN 60191-6-12:2011-12 | Identical |
| UNE-EN 60191-6-12:2004 | Identical |
| I.S. EN 60191-6-12:2011 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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