• EN 60191-6:2009

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES

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    Published date:  23-12-2009

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Design rules
    5 Dimensions to be specified
    6 Notes
    Annex A (informative) - Illustration of the rules
    Annex B (informative) - Optional table format
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides rules for the preparation of outlines drawings of surface-mounted semiconductor devices.

    General Product Information - (Show below) - (Hide below)

    Committee SR 47D
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 60191-6-20:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    CEI EN 60191-6-17 : 2012 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    BS EN 60191-6-13:2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    CEI EN 60191-6-20 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    BS EN 60191-6-17 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    BS EN 60191-6-21 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    CEI EN 60191-6-18 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    BS EN 60191-6-20 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    CEI EN 60191-6-21 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    BS EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    I.S. EN 60191-6-21:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    CEI EN 60191-6-13 : 2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
    BS EN 61240:2012 Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    I.S. EN 61240:2017 PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
    I.S. EN 60191-6-13:2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
    BS EN 60191-6-18 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    BS EN 61837-2 : 2011 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES
    BS EN 61837-3:2015 Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections Metal enclosures
    I.S. EN 60191-6-18:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    I.S. EN 60191-6-17:2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    CEI EN 61240 : 2013 PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
    BS EN 60191-6-12 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
    I.S. EN 60191-6-12:2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    EN 61837-2:2011/A1:2014 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES (IEC 61837-2:2011/A1:2014)
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    EN 60191-6-20:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    EN 60191-6-13 : 2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA) (IEC 60191-6-13:2016)
    EN 60191-6-18 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    EN 61837-3:2015 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 3: METAL ENCLOSURES (IEC 61837-3:2015)
    EN 60191-6-17 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    EN 61240 : 2017 PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES (IEC 61240:2016)
    EN 60191-6-21 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    EN 60191-6-12:2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    ISO 2692:2014 Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR)
    EN ISO 1101:2017 GEOMETRICAL PRODUCT SPECIFICATIONS (GPS) - GEOMETRICAL TOLERANCING - TOLERANCES OF FORM, ORIENTATION, LOCATION AND RUN-OUT (ISO 1101:2017)
    ISO 1101:2017 Geometrical product specifications (GPS) Geometrical tolerancing Tolerances of form, orientation, location and run-out
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    EN 60191-3 : 1999 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 3 - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF INTEGRATED CIRCUITS
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    EN ISO 2692:2014 GEOMETRICAL PRODUCT SPECIFICATIONS (GPS) - GEOMETRICAL TOLERANCING - MAXIMUM MATERIAL REQUIREMENT (MMR), LEAST MATERIAL REQUIREMENT (LMR) AND RECIPROCITY REQUIREMENT (RPR) (ISO 2692:2014)
    IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
    EN 60191-1 : 2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
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