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BS EN 60191-6-13:2016

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-12-2016

€217.36
Excluding VAT

Committee
EPL/47
DevelopmentNote
Supersedes 05/30132033 DC. (01/2008) Supersedes 13/30284025 DC. (12/2016)
DocumentType
Standard
Pages
24
PublisherName
British Standards Institution
Status
Current
Supersedes

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

Standards Relationship
EN 60191-6-13:2016 Identical
DIN EN 60191-6-13:2013-07 (Draft) Identical
NF EN 60191-6-13 : 2017 Identical
I.S. EN 60191-6-13:2016 Identical
IEC 60191-6-13:2016 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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