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EN 60191-6-13:2016

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Published date

25-11-2016

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Socket code
5 Terminal number
6 Socket nominal dimension
7 Socket length and width
8 Reference symbols and schematics
9 Individual outline drawing standard registration
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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