• NBN EN 60191-6 : 2010

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES

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    Published date:  12-01-2013

    Publisher:  Belgian Standards

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Definitions
    4 Design rules
    5 Dimensions to be specified
    6 Notes
    Annex A (informative) Illustration of the rules
      A.1 Gull-wing lead package with two parallel rows of
          terminals (SOP,TSOP Type 2)
      A.2 Gull-wing lead package with two parallel rows of
          terminals (TSOP Type 1)
      A.3 Gull-wing lead package with one row of terminals
          on each of four sides (QFP)
      A.4 J-bent lead package with two parallel rows of
          terminals (SOJ)
      A.5 Folded lead package with one row of terminals on
          each of four sides (QFJ)
      A.6 Leadless package
          A.7-1 Ball grid array package (BGA) Type 1
          A.7-2 Ball grid array package (BGA) Type 2
    Annex B (informative) Optional table format
    Annex ZA (normative) Normative references to international
                           publications with their corresponding
                           European publications
    Figures

    Abstract - (Show below) - (Hide below)

    Provides rules for the preparation of outlines drawings of surface-mounted semiconductor devices.

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    Document Type Standard
    Publisher Belgian Standards
    Status Current
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