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  • BS EN 60191-6-3:2001

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-05-2001

    Publisher:  British Standards Institution

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    Abstract - (Show below) - (Hide below)

    Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Also numbered as IEC 60191-6-3 (05/2001)
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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