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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAT FLAT PACKS (QFP)
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Available format(s): Hardcopy, PDF
Language(s): German
Published date: 01-01-2001
Publisher: German Institute for Standardisation (Deutsches Institut für Normung)
Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.
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