• I.S. EN 60191-6-3:2001

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2001

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Abstract - (Show below) - (Hide below)

    Provides a method for quad flat packs measuring dimensions which are classified into Form E.

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    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current
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