BS EN 60191-6-4:2003
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
Hardcopy , PDF
English
04-08-2003
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
4.1 Ball grid array package (BGA) Type 1 - Ball datum
4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
5.1 Datum S pertaining to ball coplanarity
5.2 Datum A, B
5.3 Definition of specified dimensions and measuring method
5.4 Profile of a package edge surface v
5.5 Mounting height A
5.6 First stand-off A1
5.7 Second stand-off A4
5.8 Ball diameter b
5.9 Ball center position X
5.10 Ball coplanarity y
5.11 Package top flatness y1
Annex ZA: Normative references to international publications
with their corresponding European publications
Includes requirements for the measuring methods of ball grid array (BGA) dimensions.
Committee |
EPL/47
|
DevelopmentNote |
Supersedes 01/207685 DC. (09/2003)
|
DocumentType |
Standard
|
Pages |
20
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Standards | Relationship |
IEC 60191-6-4:2003 | Identical |
I.S. EN 60191-6-4:2003 | Identical |
NF EN 60191-6-4 : 2003 | Identical |
DIN EN 60191-6-4:2004-01 | Identical |
NBN EN 60191-6-4 : 2004 | Identical |
SN EN 60191-6-4 : 2003 | Identical |
EN 60191-6-4:2003 | Identical |
IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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