BS EN 60191-6-5:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)
Hardcopy , PDF
English
15-11-2001
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1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.
| Committee |
EPL/47
|
| DevelopmentNote |
Also numbered as IEC 60191-6-5. (12/2001)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
| Standards | Relationship |
| UNE-EN 60191-6-5:2002 | Identical |
| EN 60191-6-5:2001 | Identical |
| I.S. EN 60191-6-5:2002 | Identical |
| DIN EN 60191-6-5:2002-05 | Identical |
| NF EN 60191-6-5 : 2002 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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