BS EN 60249-2-8:1995
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Specifications Specification for flexible copper-clad polyester (PETP) film
Hardcopy , PDF
English
01-02-1995
01-10-2006
National foreword
Committees responsible
Specification
1. Scope
2. Materials and construction
3. Internal marking
4. Electrical properties
5. Non-electrical properties of the copper-clad film
6. Non-electrical properties of the base material
after complete removal of the copper foil
7. Packaging and marking
8. Acceptance testing
9. Additional requirements
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.8(1990). 1995 version incorporates amendment 8417 to BS 4584-102.8(1990). Also numbered as IEC 60249-2-8. Supersedes BS 4584-9(1977) & 89/22203 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| EN 60249-2-8 : 1994 COR 1994 | Identical |
| I.S. EN 60249-2-8:1995 | Identical |
| DIN EN 60249-2-8:1994-09 | Identical |
| UNE-EN 60249-2-8:1996 | Identical |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS EN 60249-1:1993 | Base materials for printed circuits Base materials for printed circuits. Test methods |
| BS 4584-103.2:1990 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials |
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