Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-11-2006

Publisher

British Standards Institution

1 Scope
2 Terms and definitions
3 Test apparatus
  3.1 Reflective acoustic microscope system
  3.2 Through transmission acoustic microscope system
  3.3 Reference packages or standards
  3.4 Sample holder
4 Procedure
  4.1 General
  4.2 Equipment setup
  4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet
        (example only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
        applicable scanned data
Bibliography

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.

Committee	EPL/47
DevelopmentNote	Supersedes 04/30117780 DC (12/2006)
DocumentType	Standard
Pages	24
PublisherName	British Standards Institution
Status	Current
Supersedes	04/30117780 DC : DRAFT AUG 2004

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Standards	Relationship
DIN EN 60749-35:2007-03	Identical
I.S. EN 60749-35:2006	Identical
IEC 60749-35:2006	Identical
NF EN 60749-35 : 2006	Identical
EN 61140:2002	Identical
NBN EN 60749-35 : 2007	Identical
EN 60749-35:2006	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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BS EN 60749-35:2006

Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components

Table of Contents

Abstract

General Product Information

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