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    I.S. EN 60749-35:2006

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2006

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Terms and definitions
    3 Test apparatus
      3.1 Reflective acoustic microscope system
      3.2 Through transmission acoustic microscope system
      3.3 Reference packages or standards
      3.4 Sample holder
    4 Procedure
      4.1 General
      4.2 Equipment setup
      4.3 Performance of acoustic scans
    Annex A (informative) Acoustic microscopy check sheet (example
            only - not a mandatory template)
    Annex B (informative) Potential image pitfalls
    Annex C (informative) Some limitations of acoustic microscopy
    Annex D (informative) Reference checklist for presenting
            applicable scanned data
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

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    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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