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DIN EN 60749-35:2007-03

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2007

1 Scope
2 Terms and definitions
3 Test apparatus
  3.1 Reflective acoustic microscope system
  3.2 Through transmission acoustic microscope system
  3.3 Reference packages or standards
  3.4 Sample holder
4 Procedure
  4.1 General
  4.2 Equipment setup
  4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet
        (example only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
        applicable scanned data
Bibliography

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.

DevelopmentNote
Supersedes DIN IEC 60749-35. (03/2007)
DocumentType
Standard
Pages
21
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current
Supersedes

Standards Relationship
NF EN 60749-35 : 2006 Identical
NBN EN 60749-35 : 2007 Identical
BS EN 60749-35:2006 Identical
EN 60749-35:2006 Identical
I.S. EN 60749-35:2006 Identical
IEC 60749-35:2006 Identical

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