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  • BS EN 60749-35:2006

    Current The latest, up-to-date edition.

    Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-11-2006

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Terms and definitions
    3 Test apparatus
      3.1 Reflective acoustic microscope system
      3.2 Through transmission acoustic microscope system
      3.3 Reference packages or standards
      3.4 Sample holder
    4 Procedure
      4.1 General
      4.2 Equipment setup
      4.3 Performance of acoustic scans
    Annex A (informative) Acoustic microscopy check sheet
            (example only - not a mandatory template)
    Annex B (informative) Potential image pitfalls
    Annex C (informative) Some limitations of acoustic microscopy
    Annex D (informative) Reference checklist for presenting
            applicable scanned data
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.

    Scope - (Show below) - (Hide below)

    Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 04/30117780 DC (12/2006)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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