BS EN 61163-1:2006
Current
The latest, up-to-date edition.
Reliability stress screening Repairable assemblies manufactured in lots
Hardcopy , PDF
English
31-08-2007
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols
5 General description
5.1 The reliability stress screening principle
5.2 Failure categories
5.3 Time of occurrence of failures
6 Planning
6.1 Stress conditioning
6.2 Evaluation of the failure-free period T[M]
6.3 Time graphs for determination of the failure-free period
7 Pilot-production screening
7.1 General
7.2 Collection of information
7.3 Evaluation of information
7.4 Re-evaluating the failure-free period T[M]
8 Mature production screening
8.1 General
8.2 Collection of information
8.3 Evaluation of information
8.4 Dealing with discrepancies
8.5 Eliminating reliability stress screening
Annex A (informative) Stress conditions - General information
Annex B (informative) Stress conditions - Temperature
Annex C (informative) Stress conditions - Vibration and bump
Annex D (informative) Stress conditions - Humidity
Annex E (informative) Stress conditions - Operational stress
Annex F (informative) Voltage stress
Annex G (informative) Highly accelerated stress screening
Annex H (informative) Bimodal distributions - Weibull plotting
and analysis
Annex I (informative) Evaluation of the failure-free period
and the average screening duration
Annex J (informative) Worked example
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
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