BS EN 61188-1-1:1997
Current
The latest, up-to-date edition.
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Hardcopy , PDF
English
15-12-1997
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INTRODUCTION
1 Scope
2 Normative reference
3 Basic requirements
3.1 Design
3.2 Rigid board manufacturer
3.3 Assembly
3.4 Use
4 Deviations from flatness - rigid copper-clad
base material
4.1 Causes
4.2 Prevention and correction
4.3 Test methods and requirements
5 Deviations from flatness - unassembled rigid
printed boards
5.1 Causes
5.2 Prevention
5.3 Ratification
5.4 Requirements for flatness
5.5 Measurement methods
6 Deviations from flatness - rigid printed board
assemblies
6.1 Causes
6.2 Prevention
6.3 Correction
7 Problems associated with placement of surface-mounted
components
7.1 Placement of components (assembly)
7.2 Requirements for "pick-and-place" machines
8 Deviations from flatness in service
9 Prevention summary
10 Corrective action summary
Annex ZA (normative) Normative references to international
publications with their corresponding European publications
Covers factors controlling the flatness of rigid printed boards with their assemblies in order to advise the designer, manufacturer, assembler and user of rigid printed boards and assemblies of issues affecting flatness. Includes advice with regard to design, base material, unassembled printed board and printed board assemblies.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS 6221-23(1991) (03/2001) Also numbered as IEC 61188-1-1 Supersedes 96/206958 DC (11/2005)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 61188-1-1:1998-03 | Identical |
| EN 61188-1-1:1997 | Identical |
| I.S. EN 61188-1-1:1999 | Identical |
| SN EN 61188-1-1 : 1997 | Identical |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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