BS EN 61188-1-2:1998
Current
The latest, up-to-date edition.
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Hardcopy , PDF
English
15-12-1998
INTRODUCTION
1 Scope
2 Normative references
3 Engineering design overview
3.1 Device selection
3.2 Intraconnection
3.3 Printed board and printed board assemblies
3.4 Performance requirements
3.5 Power distribution
4 Design of controlled impedance circuits
4.1 Configurations
4.2 Equations
4.3 Controlled impedance design rules
4.4 Cross-talk rules
4.5 Coupon design rules
4.6 Decoupling/capacitor rules
5 Design for manufacturing
5.1 Process rules in CAD
5.2 Design complexity and correlation to cost
6 Data description
6.1 Details of construction
6.2 Isolation of data by net class (noise, timing,
capacitance and impedance)
6.3 Electrical performance
7 Material
7.1 Resin systems
7.2 Reinforcements
7.3 Prepregs, bonding layers and adhesives
7.4 Frequency dependence
8 Fabrication
8.1 General
8.2 Preproduction processes
8.3 Production processes
8.4 Impact of defects at high frequencies
8.5 Data description
9 Time domain reflectometry (TDR) testing
9.1 Rationale
Annex A Units, symbols and terminology
Annex ZA Normative references to international publications
with their corresponding European publications
Intended for use by circuit designers, packaging engineers, printed board manufacturers and procurement personnel in order that all may have a common understanding of each area. Intended to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are specified as designs where the interconnecting properties affect circuit performance and need unique considerations.
Committee |
EPL/501
|
DevelopmentNote |
Supersedes BS 6221-23(1991) (03/2001) Also numbered as IEC 61188-1-2 Supersedes 95/208504 DC (08/2004)
|
DocumentType |
Standard
|
Pages |
38
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Standards | Relationship |
DIN EN 61188-1-2:1999-03 | Identical |
SN EN 61188-1-2 : 1998 | Identical |
EN 61188-1-2:1998 | Identical |
NF EN 61188-1-2 : 2000 | Identical |
BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
IEC 61182-1:1994 | Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form |
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