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BS EN 61249-2-12:1999

Current

Current

The latest, up-to-date edition.

Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-06-1999

€165.94
Excluding VAT

Committee
EPL/501
DevelopmentNote
Also numbered as IEC 61249-2-12 Supersedes 95/208512 DC (08/2004)
DocumentType
Standard
Pages
20
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
UNE-EN 61249-2-12:2001 Identical
EN 61249-2-12:1999 Identical
SN EN 61249-2-12 : 1999 Identical
NF EN 61249-2-12 : 2002 Identical
DIN EN 61249-2-12:1999-11 Identical
I.S. EN 61249-2-12:1999 Identical

BS 6221-21:2001 Printed wiring boards Guide to the rework of unassembled boards

EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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