BS EN 61249-2-12:1999
Current
Current
The latest, up-to-date edition.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
15-06-1999
Publisher
€170.31
Excluding VAT
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 61249-2-12 Supersedes 95/208512 DC (08/2004)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 61249-2-12:1999 | Identical |
| NF EN 61249-2-12 : 2002 | Identical |
| DIN EN 61249-2-12:1999-11 | Identical |
| I.S. EN 61249-2-12:1999 | Identical |
| UNE-EN 61249-2-12:2001 | Identical |
| BS 6221-21:2001 | Printed wiring boards Guide to the rework of unassembled boards |
| EN 61249-5-1:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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