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BS EN 62047-4:2010

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS

Published date

30-11-2010

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1 Scope
2 Normative references
3 Terms, definitions, units and symbols
4 Standard environmental conditions
5 Marking
6 Quality assessment procedures
7 Test and measurement procedures
Annex A (normative) - Sampling procedures
Annex B (informative) - Classification for MEMS technologies
        and devices
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines generic specifications for micro-electromechanical Systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS.

Committee
EPL/47
DevelopmentNote
Supersedes 07/30148822 DC. (11/2010)
DocumentType
Standard
PublisherName
British Standards Institution
Status
Current
Supersedes

IEC 62047-4:2008 describes the generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. IEC 62047-4:2008 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.

Standards Relationship
IEC 62047-4:2008 Identical
EN 62047-4:2010 Identical

IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC 60721-2-1:2013 Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
EN 61193-2 : 2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
IEC 60721-3-0:1984+AMD1:1987 CSV Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60721-3-1:1997 Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage

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