BS EN 62047-5:2011
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Hardcopy , PDF
English
30-04-2013
1 Scope
2 Normative references
3 Terms and definitions
4 Essential ratings and characteristics
5 Measuring methods
6 Reliability (performance)
Annex A (informative) - General description of RF MEMS
Switches
Annex B (informative) - Geometry of RF MEMS switches
Annex C (informative) - Packaging of RF MEMS switches
Annex D (informative) - Failure mechanism of RF MEMS switches
Annex E (informative) - Applications of RF MEMS switches
Annex F (informative) - Measurement procedure of RF MEMS
switches
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Specifies terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches.
Committee |
EPL/47
|
DevelopmentNote |
Supersedes 07/30172155 DC. (09/2011)
|
DocumentType |
Standard
|
Pages |
38
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) switches with various structures, contacts (d.c. contact and capacitive contact), configurations (series and shunt), switching networks (SPST, SPDT, DPDT, etc.), and actuation mechanism such as electrostatic, electro-thermal, electromagnetic, piezoelectric, etc. The RF MEMS switches are promising devices in advanced mobile phones with multi-band/mode operation, smart radar systems, reconfigurable RF devices and systems, SDR (Software Defined Radio) phones, test equipments, tunable devices and systems, satellite, etc.
Standards | Relationship |
IEC 62047-5:2011/COR1:2012 | Identical |
EN 62047-5:2011 | Identical |
IEC 62047-5:2011 | Identical |
IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
EN 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
EN 60749-27:2006/A1:2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) |
EN 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
EN 60747-16-1:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV | Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
EN 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
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