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  • EN 60749-5:2017

    Current The latest, up-to-date edition.

    Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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    Language(s): 

    Published date:  07-07-2017

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General
    5 Equipment
    6 Test conditions
    7 Procedures
    8 Failure criteria
    9 Safety
    10 Summary
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    IEC 60749-5:2017(E) provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.This edition includes the following significant technical changes with respect to the previous edition:a) correction of an error in an equation;b) inclusion of notes for guidance;c) clarification of the applicability of test conditions.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 47
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
    CEI EN 60747-15 : 2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
    BS EN 60749-30 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
    EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
    CEI EN 60749-24 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
    BS EN 60749-4:2017 Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST)
    EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices RF MEMS switches
    BS EN 60749-24:2004 Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
    CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
    I.S. EN 62047-5:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    I.S. EN 60749-30:2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    CEI EN 60749-4 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    I.S. EN 60749-24:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
    EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
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