BS EN 62258-6:2006
Current
The latest, up-to-date edition.
Semiconductor die products Requirements for information concerning thermal simulation
Hardcopy , PDF
English
30-11-2006
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INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
5.1 Requirements for bare die with or without added
connection structures
5.2 Requirements for minimally-packaged die
5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Provides the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes BS PD ES 59008-4.3 & 05/30139923 DC. (11/2006)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
| Standards | Relationship |
| IEC 62258-6:2006 | Identical |
| NBN EN 62258-6 : 2007 | Identical |
| EN 62258-6 : 2006 | Identical |
| DIN EN 62258-6:2007-02 | Identical |
| I.S. EN 62258-6:2006 | Identical |
| NF EN 62258-6 : 2006 | Identical |
| EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
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