BS EN 62319-1:2005
Current
The latest, up-to-date edition.
Polymeric thermistors. Directly heated positive step function temperature coefficient Generic specification
Hardcopy , PDF
English
31-12-2009
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1 General
2 Technical data
3 Quality assessment procedures
4 Test and measurement procedures
Annex A (normative) - Fixed sample size test schedules
for qualification approval
Annex B (normative) - Vibration-, bump-, shock-, shear-,
substrate bending test
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Specifies terms and methods of test for polymeric positive temperature coefficient thermistors, insulated and non-insulated types, typically intended for use in current limiting and overcurrent protection applications.
| Committee |
W/-
|
| DevelopmentNote |
Supersedes 02/208665 DC (06/2006)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 62319-1 : 2005 COR 1 2009 | Identical |
| IEC 62319-1:2005/COR1:2009 | Identical |
| IEC 62319-1:2005 | Identical |
| NBN EN 62319-1 : 2006 | Identical |
| NF EN 62319-1 : 2005 | Identical |
| I.S. EN 62319-1:2005 | Identical |
| EN 62319-1:2005 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| HD 60027-1:2004 | Letter symbols to be used in electrical technology - Part 1: General |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IECQ 001003:1998 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - GUIDANCE DOCUMENTS |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-2-29:1993 | Environmental testing - Part 2: Tests - Test Eb and guidance: Bump |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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