BS EN 62739-1:2013
Current
Current
The latest, up-to-date edition.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
30-09-2013
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 12/30250506 DC. (10/2013)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Standards | Relationship |
| EN 62739-1 : 2013 | Identical |
| IEC 62739-1:2013 | Identical |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-3:2014 | Stainless steels for general purposes — Part 3: Wire |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-2:2014 | Stainless steels for general purposes — Part 2: Corrosion-resistant semi-finished products, bars, rods and sections |
| ISO 16143-1:2014 | Stainless steels for general purposes — Part 1: Corrosion-resistant flat products |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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