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BS PD IEC TR 62258-3 : 2005

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE

Available format(s)

Hardcopy , PDF

Superseded date

30-05-2008

Superseded by

PD CLC/TR 62258-3:2007

Language(s)

English

Published date

01-01-2005

€287.48
Excluding VAT

INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
   4.1 General
   4.2 Working environmental controls
   4.3 General handling precautions
   4.4 Cleanroom good practice
5 Process handling issues
   5.1 Wafer sawing
   5.2 Die sorting
6 Die and wafer transport and storage media
   6.1 Wafer carriers and cassettes
   6.2 In-process carriers and transport systems
   6.3 Packing for shipment of unsawn wafers
   6.4 Packing for shipment of sawn wafers
   6.5 Packing for shipment of single wafers
   6.6 Packing for shipment of die using trays
   6.7 Packing for shipment of die using tape-and-reel
   6.8 Secondary packing for shipment
7 Storage good practice
   7.1 Die and wafer storage
   7.2 Short-term storage environment and conditions
   7.3 Storage time limitations
   7.4 Sawn wafer on wafer frame or ring
   7.5 Die products in the production area
   7.6 Die in tape-and-reel
   7.7 Dry-packed die products
8 Traceability good practice
   8.1 General
   8.2 Wafer traceability
   8.3 Die products traceability
   8.4 Wafer and die back side marking
9 Guidelines for long-term storage (die banking) of bare
   die and wafers
   9.1 General
   9.2 Preparing for storage
   9.3 Damage to die products during long-term storage
   9.4 Long-term storage environment
   9.5 Recommended inert atmosphere purity
   9.6 Chemical contamination
   9.7 Electrical effects
   9.8 Protection from radiation
   9.9 Periodic qualification of stored die products
10 Good practice for automated handling during assembly
   10.1 Removal of die from shipping media
   10.2 Equipment out of service
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography

Facilitates the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers. Suggests good practice for the handling, packing and storage of die products.

Committee
EPL/47
DevelopmentNote
Supersedes 04/30110525 DC. (12/2005) Renumbered and superseded by BS PD CLC/TR 62258-3. (05/2008)
DocumentType
Standard
Pages
46
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
IEC TR 62258-3:2010 Identical

IEC TS 61340-5-2:1999 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

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