• IEC 60286-3:2013

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  31-12-2021

    Language(s):  English - French

    Published date:  17-05-2013

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 General
    2 Terms and definitions
    3 Structure of the specification
    4 Dimensional requirements for taping
    5 Polarity and orientation requirements
       of components in the tape
    6 Carrier tape requirements
    7 Cover tape requirements (for type 1a, 1b,
       2a, 2b and 3)
    8 Component taping and additional tape requirements
    9 Reel requirements
    10 Tape reeling requirements
    Annex A (normative) - Recommended measuring methods
            for type 1b
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition:
    a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes);
    b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

    General Product Information - (Show below) - (Hide below)

    Committee TC 40
    Development Note Formerly IEC 286-3 (05/2002) Stability Date: 2017. (10/2012) Supersedes IEC 60286-3-1 & IEC 60286-3-2. (05/2013)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS CECC 00802:1991 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDs) OF ASSESSED QUALITY
    I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    BS PD IEC TR 62258-3 : 2005 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    BS ISO 21067-1:2016 (published 2016-12) Packaging. Vocabulary General terms
    06/30155852 DC : DRAFT SEP 2006 BS EN 60286-3-6 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 6 - PACKAGING OF SURFACE MOUNT COMPONENTS ON BLISTER CARRIER TAPES 4 MM IN WIDTH
    BS PD CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    BS EN 60393-6 : 2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
    97/231700 DC : DRAFT DEC 1997 IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60115-8 : 2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    16/30350953 DC : 0 BS EN 60286-1 ED 3.0 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 1: TAPE PACKAGING OF COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES
    CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    BS EN 60286-1:2017 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 1: TAPE PACKAGING OF COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES
    CEI CECC 32101-804 : 2002 SPECIFICA DI DETTAGLIO: CONDENSATORI FISSI CERAMICI MULTISTRATO A MONTAGGIO SUPERFICIALE, CLASSE 1, SOTTOCLASSE 1B, TIPO CG, CATEGORIA CLIMATICA 55/125/56, LIVELLO EZ
    BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    BS EN 140401-801 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    04/30110525 DC : DRAFT MARCH 2004 IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    BS EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    BS EN 60115-8-1 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    CEI EN 60384-3-1 : 2007 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    09/30209389 DC : 0 BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E
    BS EN 61188-5-4 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    BS EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS EN 61760-3:2010 (published 2010-06) Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
    BS EN 60286-3-1 : 2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES
    06/30156418 DC : DRAFT SEP 2006 BS EN 60286-3-5 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 5: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS PRESSED CARRIER TAPES
    BS EN 62090 : 2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
    09/30186180 DC : 0 BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    16/30333617 DC : 0 BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    06/30155905 DC : DRAFT SEP 2006 BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    09/30207307 DC : 0 BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS
    CEI EN 61760-2 : 2008 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    05/30129971 DC : DRAFT FEB 2005 EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    BS EN 60384-3-1 : 2006 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    14/30317306 DC : 0 BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS EN 60286-3-2:2009 (published 2010-02) Packaging of components for automatic handling Packaging of surface mount components on continuous tapes. Type VI. Blister carrier tapes of 4 mm width
    DIN EN 129101:1994-03 BLANK DETAIL SPECIFICATION: WIREWOUND SURFACE MOUNTING INDUCTORS OF ASSESSED QUALITY: ASSESSMENT LEVEL E
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 60384-3-1:2007 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    I.S. EN 60286-3-1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES
    I.S. EN 60286-3-2:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH
    BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140401-804:2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    EN 60286-1:2017 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 1: TAPE PACKAGING OF COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES (IEC 60286-1:2017)
    I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
    I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    I.S. EN 62090:2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    CEI CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    BS EN 140401-804 : 2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    BS EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 60393-6:2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
    CEI CECC 32101-805 : 2002 DETAIL SPECIFICATION: FIXED MULTILAYER CERAMIC SURFACE MOUNTING CAPACITORS, CLASS 2, SUB-CLASSES 2C1 AND 2R1, CLIMATIC CATEGORY 55/125/56, ASSESSMENT LEVEL EZ, WITH FAILURE RATE LEVELS
    EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    NF EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
    ISO 21067-1:2016 Packaging Vocabulary Part 1: General terms
    EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. EN 140401-801:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 61760-2:2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    NF EN 140402-801 : 2005 DETAIL SPECIFICATION: FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5, 1, 2
    IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
    I.S. EN 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    IEC 60286-1:2017 Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 60115-8-1:2014 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    I.S. EN 60286-1:2017 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 1: TAPE PACKAGING OF COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES
    EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    EN 140401-801:2007/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    IEC 60384-3-1:2006 Fixed capacitors for use in electronic equipment - Part 3-1: Blank detail specification: Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte - Assessment level EZ
    IEC 60393-6:2015 Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers
    BS EN 61188-5-2 : 2003 PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    IEC 60286-3-2 : 1.0 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH
    IEC 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    IEC 60286-3-1 : 1.0 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES
    BS EN 140402-801 : 2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 140401-804:2011/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    EN 62090:2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
    EN 60286-3-1 : 2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES
    EN 129000:1993/A1:1995 GENERIC SPECIFICATION - FIXED RF WOUND INDUCTORS
    EN 129100 : 93 AMD 1 95 SECTIONAL SPECIFICATION: WIREWOUND SURFACE MOUNTING INDUCTORS
    EN 61188-5-2 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    EN 60384-3-1:2006/corrigendum:2009 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    EN 60393-6 : 2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS (IEC 60393-6:2015)
    EN 60115-8 : 2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009, MODIFIED)
    EN 60115-8-1 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G (IEC 60115-8-1:2014, MODIFIED)
    EN 61188-5-4 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    EN 60286-3-2 : 2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60286-3-2 : 1.0 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH
    IEC 60286-3-1 : 1.0 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    ISO 11469:2016 Plastics Generic identification and marking of plastics products
    IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
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