• IEC TS 61340-5-2:1999

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  14-08-2007

    Language(s):  English - French, Spanish, Castilian

    Published date:  26-02-1999

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Definitions
    4 Signs and markings - General
       4.1 Markings
            4.1.1 ESDS marking
            4.1.2 Packaging marking
            4.1.3 Equipment marking
       4.3 Signs for ESD protected areas (EPA)
    5 ESD protected area (EPA) - General
       5.1 Configuration
            5.1.1 General
            5.1.3 High-voltage EPA
       5.2 Requirements for specific ESD protective items
            5.2.1 General
            5.2.2 Working surfaces and storage racks
            5.2.3 Floors
            5.2.4 Seating
            5.2.5 Garments
            5.2.6 Gloves and finger cots
            5.2.7 Wrist strap
            5.2.8 Footwear
            5.2.9 Ionisers
            5.2.10 Tools, machinery, dispensers and test equipment
            5.2.11 Trolleys and carts
       5.3 Construction of an EPA
            5.3.1 General
            5.3.2 EPA ground facility
            5.3.3 EPA ground bonding point (EBP)
            5.3.4 EPA ground cords
            5.3.5 Electrostatic fields
            5.3.6 Certification of conformance
       5.4 Field work
       5.5 EPA working practices
    6 Protective packaging
    7 Purchase, receipt, storage and handling
       7.1 General
       7.2 Purchase
       7.3 Receipt and storage
       7.4 Unpacking, inspection and storage within an EPA
    8 Training
       8.1 Relevant structured training ESD
       8.2 Personnel training
       8.4 Items for consideration in training
       8.5 Retraining
       8.6 Register of trained personnel
       8.7 Training provided by the ESD co-ordinator
       8.8 Training officer qualification
    9 Quality responsibilities
       9.1 Responsibilities
       9.2 ESD co-ordinator
       9.3 Procurement of ESD protective items
       9.4 Checking of electrostatic precautions
       9.6 Daily checks
            9.6.1 Visual daily check
            9.6.2 Wrist straps
            9.6.3 Non-permanent footwear
       9.7 Monthly checks
       9.8 Six-monthly checks
            9.8.1 General
            9.8.2 Electrostatic fields
            9.8.3 Signs and labels
    10 Periodic audit instructions
       10.1 Table 1 of IEC 61340-5-1 - ESD protective item
            requirements
       10.2 Table 2 of IEC 61340-5-1 - Packaging
            characteristics
       10.3 Table 3 of IEC 61340-5-1 - Example of audit
            report (summary)
       10.4 Table 4 of IEC 61340-5-1 - EPA equipment list
    Annex A (normative) Test methods
          A.1 - Resistance measurement method for the testing of
                floor, working surface or storage rack
          A.2 - Resistance measurement method for the testing of
                seating
          A.3 - Resistance measurement method for the testing of
                garments
          A.5 - Wrist straps, footwear, gloves, finger cots and
                tools
          A.6 - Test method and equipment for ionisation
          A.7 - Test method for evaluating the performance of
                electrostatic discharge shielding material -
                Bags
    Annex B (informative) Test methods for charge decay
          B.1 - Method of measurement of charge decay
    Annex C (informative) Design considerations to minimise the
                          effects of ESD
          C.1 - Identification
          C.3 - Design of electrostatic discharge sensitive
                devices (ESDS)
          C.4 - Design of assemblies
          C.5 - Packaging design
          C.6 - System design
          C.7 - Design evaluation procedure
    Annex DD (informative) Principles and methods of controlling
                           static electricity
          DD.1 - Methods
          DD.2 - Principles
    Annex EE (informative) Principles of relationship between
                           charge, charge density, field and
                           potential
          EE.1 - Insulated conducting body
          EE.2 - Insulating body
    Annex FF (informative) Bibliography
    Figure 101 - Maximum body voltage generated against resistance

    Abstract - (Show below) - (Hide below)

    Covers the protection from electrostatic discharge (ESD) damage of all electronic devices (components, assemblies and sub-assemblies) with voltage sensitivity of not lower than 100 V throughout their entire life. This is from the commencement of manufacture, through product assembly, product use and possible repair until the end of the product life. Is to be read in conjunction with IEC 61340-5-1.

    General Product Information - (Show below) - (Hide below)

    Committee TC 101
    Development Note To be read in conjunction with IEC 61340-5-1 (11/2001)
    Document Type Technical Specification
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
    07/30169405 DC : 0 BS EN 60747-16-3 AMD1 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    DD IEC PAS 62435 : 2005 ELECTRONIC COMPONENTS - LONG-DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDANCE FOR IMPLEMENTATION
    BS PD IEC TR 62258-3 : 2005 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    06/30155852 DC : DRAFT SEP 2006 BS EN 60286-3-6 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 6 - PACKAGING OF SURFACE MOUNT COMPONENTS ON BLISTER CARRIER TAPES 4 MM IN WIDTH
    BS PD CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    05/30139061 DC : DRAFT SEP 2005 IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
    BS PD IEC 62239 : 2001 ELECTRONIC COMPONENT MANAGEMENT PLANS
    DD CLC/TS 50466:2006 (published 2008-06) Long duration storage of electronic components. Specification for implementation
    IEC PAS 62239:2001 Electronic component management plans
    13/30286163 DC : 0 BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
    CEI EN 60747-16-1 : 2009 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    04/30110525 DC : DRAFT MARCH 2004 IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    BS EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    BS IEC 61340-5.1 : 1998 AMD 13198 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
    07/30169412 DC : 0 BS EN 60747-16-4 AMD1 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    07/30152286 DC : 0
    CEI EN 61760-2 : 2008 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
    BS EN 60747-16-1 : 2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    03/317589 DC : 0 IEC 61340-5-1 ED.2 - ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
    EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. EN 61760-2:2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. EN 60747-16-1:2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    EN 60747-16-1:2002/A2:2017 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017)
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    EIA 4899 : 2001 STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC TS 60479-1:2005+AMD1:2016 CSV Effects of current on human beings and livestock - Part 1: Generalaspects
    IEC 61340-4-1:2003+AMD1:2015 CSV Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors
    IEC 61010-1:2010+AMD1:2016 CSV Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements
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