CEI EN 60191-6-13 : 2009
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
Hardcopy , PDF
English
01-01-2009
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Socket code
5 Terminal number
6 Socket nominal dimension
7 Socket length and width
8 Reference symbols and schematics
9 Individual outline drawing standard registration
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1010. (07/2015) 1ED 2009 Edition is valid until 01-11-2019. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-13:2016 | Identical |
| EN 60191-6-13:2016 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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