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CEI EN 60191-6-13 : 2009

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2009

€55.57
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Socket code
5 Terminal number
6 Socket nominal dimension
7 Socket length and width
8 Reference symbols and schematics
9 Individual outline drawing standard registration
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA).

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-1010. (07/2015) 1ED 2009 Edition is valid until 01-11-2019. (06/2017)
DocumentType
Standard
Pages
22
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 60191-6-13:2016 Identical
EN 60191-6-13:2016 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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