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CEI EN 60191-6-17 : 2012

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

€127.01
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Terminal position numbering
5 Drawings
6 Dimensions
7 Dimension table
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-82. (02/2012)
DocumentType
Standard
Pages
34
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 60191-6-17:2011 Identical
EN 60191-6-17:2011 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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