• Shopping Cart
    There are no items in your cart

CEI EN 60191-6-18 : 2011

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2011

€76.73
Excluding VAT

FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Terminal position numbering
5. Nominal package dimension
6. Symbols and drawings
7. Dimensions
8. Recommended BGA variations
Bibliography
Annex ZA(normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-68. (03/2011)
DocumentType
Standard
Pages
30
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 60191-6-18:2010 Identical
IEC 60191-6-18:2010 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.