CEI EN 60286-4 : 2014
Current
The latest, up-to-date edition.
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
Hardcopy , PDF
English
01-01-2014
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and conventions
4 Shape and cross-section of stick
magazine
5 Dimensions of stick magazines
6 Mechanical stability
7 End stoppers and spacers
8 Orientation of the components
in the stick magazine
9 Marking
Annex A (informative) - DIL packages
for through-hole mount
Annex B (informative) - SO packages
for surface mounting
Annex C (informative) - Leaded chip
carrier packages (PLCC) for
surface mounting
Annex D (normative) - Rule for the
orientation of integrated
circuit packages in handling
and shipping carriers such as
stick magazines and rails
(from IEC 60191-3:1999, Annex G)
Bibliography
Pertains to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 40-34. (08/2001)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60286-4:2013 | Identical |
| EN 60286-4:2013 | Identical |
| ISO 11469:2016 | Plastics — Generic identification and marking of plastics products |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
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