• IEC 60286-4:2013

    Current The latest, up-to-date edition.

    Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  26-07-2013

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.

    General Product Information - (Show below) - (Hide below)

    Committee TC 40
    Development Note Stability Date: 2018. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS ISO 21067-1:2016 (published 2016-12) Packaging. Vocabulary General terms
    BS EN 61188-5-4 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    BS EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    BS EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS EN 61760-3:2010 (published 2010-06) Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
    BS EN 62090 : 2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
    09/30186180 DC : 0 BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    16/30333617 DC : 0 BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    CEI EN 61760-2 : 2008 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    IPC 1758 : 0 DECLARATION REQUIREMENTS FOR SHIPPING, PACK AND PACKING MATERIALS
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    I.S. EN 62090:2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
    NF EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    ISO 21067-1:2016 Packaging Vocabulary Part 1: General terms
    EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. EN 61760-2:2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
    I.S. EN 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS EN 61188-5-2 : 2003 PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    IEC 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    EN 62090 : 2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017)
    EN 61188-5-2 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    EN 61188-5-4 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 11469:2016 Plastics Generic identification and marking of plastics products
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
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