CEI EN 60749-3 : 2004
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
Hardcopy , PDF
English
01-01-2004
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report
form/checklist (example only - not a
mandatory template)
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-15 (04/2004) Supersedes CEI EN 60749. (05/2008) 1ED 2004 Edition is valid until 07-04-2020. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60749-3:2017 | Identical |
| IEC 60749-3:2017 | Identical |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 62483:2013 | Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices |
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