CEI EN 62047-25 : 1ED 2017
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
08-08-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Testing method
Annex A (informative) - Dimensions for testing structure and
tensile/compressive strength
Annex B (informative) - Pull-press testing method example
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-140. (08/2017)
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-25:2016 | Identical |
| EN 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| IEC 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| EN ISO 10012:2003 | Measurement management systems - Requirements for measurement processes and measuring equipment (ISO 10012:2003) |
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