CEI EN 62047-4 : 2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
Hardcopy , PDF
English
01-01-2011
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, units and symbols
4 Standard environmental conditions
5 Marking
6 Quality assessment procedures
7 Test and measurement procedures
Annex A (normative) - Sampling procedures
Annex B (informative) - Classification for MEMS
technologies and devices
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines generic specifications for micro-electromechanical Systems made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-69. (03/2011)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-4:2008 | Identical |
| EN 62047-4:2010 | Identical |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| EN 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60721-2-1:2013 | Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity |
| IEC 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
| IEC 60721-3-0:1984+AMD1:1987 CSV | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
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