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CEI EN 62137-1-4 : 2010

Current

Current

The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

€44.98
Excluding VAT

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment and material
5 Mounting method
6 Test conditions
7 Items to be included in the test report
8 Items to be prescribed in the product specifications
Annex A (normative) - Cyclic bending test equipment
Annex ZA (normative) - Normative references to international
         Publications with their corresponding European publications

Pertains to surface mount components with a thin and wide basal plane, such as QFP and BGA.

Committee
CT 309
DevelopmentNote
Classificazione CEI 309-10. (07/2010)
DocumentType
Standard
Pages
20
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62137-1-4:2009 Identical
IEC 62137-1-4:2009 Identical

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IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
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EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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