CEI EN 62739-1 : 2014
Current
The latest, up-to-date edition.
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
Hardcopy , PDF
English
01-01-2014
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Method of erosion depth measurement (focal depth
method with optical microscope)
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment
& measurement equipment
Annex B (informative) - Method of estimation of
maximum erosion depth by extreme value
statistical analysis
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-77. (05/2014)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62739-1:2013 | Identical |
| EN 62739-1 : 2013 | Identical |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-3:2014 | Stainless steels for general purposes — Part 3: Wire |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-2:2014 | Stainless steels for general purposes — Part 2: Corrosion-resistant semi-finished products, bars, rods and sections |
| ISO 16143-1:2014 | Stainless steels for general purposes — Part 1: Corrosion-resistant flat products |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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