CEI EN 62878-1-1 : 2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
Hardcopy , PDF
13-06-2020
English
01-01-2016
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test methods
5 Shipping inspection
Annex A (informative) - Related test methods
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines the test methods of passive and active device embedded substrates.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-80. (03/2016)
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| EN 62878-1-1:2015 | Identical |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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