DIN EN 190000:1996-05
Current
The latest, up-to-date edition.
GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS
Hardcopy , PDF
German
01-01-1996
FOREWORD
PREFACE
1 SCOPE
2 GENERAL
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.3.1 General
2.3.2 General terms for integrated circuits
2.4 Standard and preferred values
2.5 Marking of component and package
2.5.1 Terminal identification
2.5.2 Factory identification code
2.5.3 Precautions for Electrostatic Sensitive
Devices
2.5.4 Optional tests
2.5.5 Marking symbols location
2.6 Ordering information
3 QUALITY ASSESSMENT PROCEDURES
3.1 Primary stage of manufacture and subcontracting
3.2 Structural similarity procedures
3.2.1 General rules
3.2.2 Test dependent criteria for structural
similarity
3.3 Qualification approval procedure
3.3.1 Definition of production lot and
inspection lot
3.3.2 Approval procedure
3.3.3 Major alterations
3.3.4 Examples of major alterations
3.4 Quality conformance inspection
3.4.1 Division into Groups and Sub-Groups
3.4.2 Quality inspection testing
3.4.3 Sampling procedures for small lots
3.4.4 Supplementary procedure for reduced
inspection
3.4.5 Re-submission of rejected lots
3.4.6 Certified test records
3.4.7 Delayed delivery
3.4.8 Delivery of devices subjected to destructive
or non-destructive tests
3.4.9 Supplementary procedure for deliveries
3.4.10 Supplementary information
3.5 Capability Approval
3.6 Inspection requirements
3.7 Statistical Process Control (SPC)
4 TEST AND MEASUREMENT PROCEDURES
4.1 Standard conditions for testing
4.1.1 Standard atmospheric conditions for
reference
4.1.2 Standard atmospheric conditions for
referee tests
4.1.3 Standard atmospheric conditions for
testing
4.1.4 Standard atmospheric conditions for
electrical measurements
4.1.5 Standard recovery conditions
4.2 Visual examination
4.2.1 Internal visual examination
(pre-cap inspection)
4.2.2 External visual examination
4.3 Dimensions
4.4 Immersion in cleaning solvents
4.5 Electrical measurement procedures
4.5.1 Ratings
4.5.2 Equilibrium conditions
4.5.3 Temperature
4.5.4 Precautions
4.5.5 Measurement circuit requirements
4.5.6 Multiple integrated circuits
4.5.7 Unspecified connections to terminals
4.5.8 Electrical measuring methods
4.5.9 Transient energy test
4.5.10 Correlated measurements
4.5.11 Die attach
4.5.12 Latch-up
4.6 Environmental testing procedures
4.6.1 Storage at high and low temperature
4.6.2 Damp heat, steady-state
4.6.3 Damp heat
4.6.4 Shock
4.6.5 Vibration (sinusoidal)
4.6.6 Vibration, fixed frequency
4.6.7 Acceleration, steady state
4.6.8 Change of temperature
4.6.9 Sealing
4.6.10 Solderability of terminations
4.6.11 Resistance of components to soldering heat
4.6.12 Robustness of terminations and integral
mounting devices
4.6.13 Industrial atmosphere
4.6.14 Salt mist
4.6.15 Flammability test of plastic encapsulated devices
4.6.16 Moisture induced cracking test
4.6.17 Internal wire pull test
4.6.18 Die shear strength test
4.7 Definition of axes for mechanical tests
4.8 Electrical endurance testing
4.8.1 General conditions
4.8.2 Test temperature and duration
4.8.3 Operating modes and specific conditions for
testing
4.8.4 Initial and end point tests
4.9 Accelerated test procedures
4.9.1 Requirements for eligibility in periodic
testing
4.9.2 Thermally accelerated electrical endurance
testing
4.9.3 Level of activation energy for thermally
accelerated tests
4.10 Screening
4.10.1 Screening procedures
4.10.2 Screens and tests description
4.10.3 Specked conditions
ANNEX A: Internal visual examination and alternate method
ANNEX B: Comparison between IEC and CECC documents
(environmental and endurance testing procedures)
ANNEX C: Capability approval
ANNEX D: CQC specification writer's guide
ANNEX E: Guide for application of structural similarity
procedures described in clause
ANNEX F: Statistical process control (SPC)
ANNEX G: EQML pour circuits integres
Specifies the terms, definitions, test methods, symbols and other material for monolithic integrated circuits.
DevelopmentNote |
Supersedes DIN 45940-1 (07/2002)
|
DocumentType |
Standard
|
Pages |
268
|
PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
Status |
Current
|
Supersedes |
Standards | Relationship |
EN 190000:1995 | Identical |
I.S. EN 190000:1996 | Identical |
BS EN 190000:1996 | Identical |
NEN EN 190000 : 1995 | Identical |
SN EN 190000 : 1995 | Identical |
IEC 60134:1961 | Rating systems for electronic tubes and valves and analogous semiconductor devices |
IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
CECC 00114 : 93 AMD 1 | QUALITY ASSESSMENT PROCEDURES - APPROVAL OF MANUFACTURERS AND OTHER ORGANIZATIONS |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
IEC 60617-13:1993 | Graphical symbols for diagrams - Part 13: Analogue elements |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
IEC 60748-2:1997 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits |
IEC 60148:1969 | Letter symbols for semiconductor devices and integrated microcircuits |
CECC 00007 : 1978 | BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES |
IEC 60748-3:1986 | Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits |
IEC 60748-4:1997 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
IEC 60617-12:1997 | Graphical symbols for diagrams - Part 12: Binary logic elements |
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