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DIN EN 190000:1996-05

Current

Current

The latest, up-to-date edition.

GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-1996

€99.35
Excluding VAT

FOREWORD
PREFACE
1 SCOPE
2 GENERAL
  2.1 Order of precedence
  2.2 Related documents
  2.3 Units, symbols and terminology
       2.3.1 General
       2.3.2 General terms for integrated circuits
  2.4 Standard and preferred values
  2.5 Marking of component and package
       2.5.1 Terminal identification
       2.5.2 Factory identification code
       2.5.3 Precautions for Electrostatic Sensitive
              Devices
       2.5.4 Optional tests
       2.5.5 Marking symbols location
  2.6 Ordering information
3 QUALITY ASSESSMENT PROCEDURES
  3.1 Primary stage of manufacture and subcontracting
  3.2 Structural similarity procedures
       3.2.1 General rules
       3.2.2 Test dependent criteria for structural
              similarity
  3.3 Qualification approval procedure
       3.3.1 Definition of production lot and
              inspection lot
       3.3.2 Approval procedure
       3.3.3 Major alterations
       3.3.4 Examples of major alterations
  3.4 Quality conformance inspection
       3.4.1 Division into Groups and Sub-Groups
       3.4.2 Quality inspection testing
       3.4.3 Sampling procedures for small lots
       3.4.4 Supplementary procedure for reduced
              inspection
       3.4.5 Re-submission of rejected lots
       3.4.6 Certified test records
       3.4.7 Delayed delivery
       3.4.8 Delivery of devices subjected to destructive
              or non-destructive tests
       3.4.9 Supplementary procedure for deliveries
       3.4.10 Supplementary information
  3.5 Capability Approval
  3.6 Inspection requirements
  3.7 Statistical Process Control (SPC)
4 TEST AND MEASUREMENT PROCEDURES
  4.1 Standard conditions for testing
       4.1.1 Standard atmospheric conditions for
              reference
       4.1.2 Standard atmospheric conditions for
              referee tests
       4.1.3 Standard atmospheric conditions for
              testing
       4.1.4 Standard atmospheric conditions for
              electrical measurements
       4.1.5 Standard recovery conditions
  4.2 Visual examination
       4.2.1 Internal visual examination
              (pre-cap inspection)
       4.2.2 External visual examination
  4.3 Dimensions
  4.4 Immersion in cleaning solvents
  4.5 Electrical measurement procedures
       4.5.1 Ratings
       4.5.2 Equilibrium conditions
       4.5.3 Temperature
       4.5.4 Precautions
       4.5.5 Measurement circuit requirements
       4.5.6 Multiple integrated circuits
       4.5.7 Unspecified connections to terminals
       4.5.8 Electrical measuring methods
       4.5.9 Transient energy test
       4.5.10 Correlated measurements
       4.5.11 Die attach
       4.5.12 Latch-up
  4.6 Environmental testing procedures
       4.6.1 Storage at high and low temperature
       4.6.2 Damp heat, steady-state
       4.6.3 Damp heat
       4.6.4 Shock
       4.6.5 Vibration (sinusoidal)
       4.6.6 Vibration, fixed frequency
       4.6.7 Acceleration, steady state
       4.6.8 Change of temperature
       4.6.9 Sealing
       4.6.10 Solderability of terminations
       4.6.11 Resistance of components to soldering heat
       4.6.12 Robustness of terminations and integral
              mounting devices
       4.6.13 Industrial atmosphere
       4.6.14 Salt mist
       4.6.15 Flammability test of plastic encapsulated devices
       4.6.16 Moisture induced cracking test
       4.6.17 Internal wire pull test
       4.6.18 Die shear strength test
  4.7 Definition of axes for mechanical tests
  4.8 Electrical endurance testing
       4.8.1 General conditions
       4.8.2 Test temperature and duration
       4.8.3 Operating modes and specific conditions for
              testing
       4.8.4 Initial and end point tests
  4.9 Accelerated test procedures
       4.9.1 Requirements for eligibility in periodic
              testing
       4.9.2 Thermally accelerated electrical endurance
              testing
       4.9.3 Level of activation energy for thermally
              accelerated tests
  4.10 Screening
       4.10.1 Screening procedures
       4.10.2 Screens and tests description
       4.10.3 Specked conditions
ANNEX A: Internal visual examination and alternate method
ANNEX B: Comparison between IEC and CECC documents
         (environmental and endurance testing procedures)
ANNEX C: Capability approval
ANNEX D: CQC specification writer's guide
ANNEX E: Guide for application of structural similarity
         procedures described in clause
ANNEX F: Statistical process control (SPC)
ANNEX G: EQML pour circuits integres

Specifies the terms, definitions, test methods, symbols and other material for monolithic integrated circuits.

DevelopmentNote
Supersedes DIN 45940-1 (07/2002)
DocumentType
Standard
Pages
268
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current
Supersedes

Standards Relationship
EN 190000:1995 Identical
I.S. EN 190000:1996 Identical
BS EN 190000:1996 Identical
NEN EN 190000 : 1995 Identical
SN EN 190000 : 1995 Identical

IEC 60134:1961 Rating systems for electronic tubes and valves and analogous semiconductor devices
IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
CECC 00114 : 93 AMD 1 QUALITY ASSESSMENT PROCEDURES - APPROVAL OF MANUFACTURERS AND OTHER ORGANIZATIONS
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60617-13:1993 Graphical symbols for diagrams - Part 13: Analogue elements
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60148:1969 Letter symbols for semiconductor devices and integrated microcircuits
CECC 00007 : 1978 BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES
IEC 60748-3:1986 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
IEC 60748-4:1997 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
IEC 60617-12:1997 Graphical symbols for diagrams - Part 12: Binary logic elements

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