DIN EN 60191-6-3:2001-06
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAT FLAT PACKS (QFP)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2001
Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.
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