DIN EN 60749-25:2004-04
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
Hardcopy , PDF
German
01-01-2004
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1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
5.1 Initial measurements
5.2 Conditioning
5.3 Cycle rates
5.4 Upper and lower soak times
5.5 Upper and lower soak temperatures
5.6 Soak modes
5.7 Cycle time
5.8 Ramp rate
5.9 Load transfer time
5.10 Recovery
5.11 Final measurements
5.12 Failure criteria
6 Summary
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
| DevelopmentNote |
Supersedes DIN EN 60749. (06/2005)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| UNE-EN 60749-25:2004 | Identical |
| BS EN 60749-25:2003 | Identical |
| EN 60749-25:2003 | Identical |
| NF EN 60749-25 : 2003 | Identical |
| SN EN 60749-25 : 2003 | Identical |
| NBN EN 60749-25 : 2004 | Identical |
| IEC 60749-25:2003 | Identical |
| I.S. EN 60749-25:2003 | Identical |
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