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    I.S. EN 60749-25:2003

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test apparatus
    5 Procedure
      5.1 Initial measurements
      5.2 Conditioning
      5.3 Cycle rates
      5.4 Upper and lower soak times
      5.5 Upper and lower soak temperatures
      5.6 Soak modes
      5.7 Cycle time
      5.8 Ramp rate
      5.9 Load transfer time
      5.10 Recovery
      5.11 Final measurements
      5.12 Failure criteria
    6 Summary
    Figure 1 - Representative temperature profile for
               thermal cycle test conditions

    Abstract - (Show below) - (Hide below)

    Specifies a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    View more information

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