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  • DIN EN 60749-25:2004-04

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2004

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test apparatus
    5 Procedure
      5.1 Initial measurements
      5.2 Conditioning
      5.3 Cycle rates
      5.4 Upper and lower soak times
      5.5 Upper and lower soak temperatures
      5.6 Soak modes
      5.7 Cycle time
      5.8 Ramp rate
      5.9 Load transfer time
      5.10 Recovery
      5.11 Final measurements
      5.12 Failure criteria
    6 Summary
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DIN EN 60749. (06/2005)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
    Supersedes
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