DIN EN 60749-35:2007-03
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS
Hardcopy , PDF
German
01-01-2007
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1 Scope
2 Terms and definitions
3 Test apparatus
3.1 Reflective acoustic microscope system
3.2 Through transmission acoustic microscope system
3.3 Reference packages or standards
3.4 Sample holder
4 Procedure
4.1 General
4.2 Equipment setup
4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet
(example only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
applicable scanned data
Bibliography
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.
| DevelopmentNote |
Supersedes DIN IEC 60749-35. (03/2007)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-35 : 2006 | Identical |
| NBN EN 60749-35 : 2007 | Identical |
| BS EN 60749-35:2006 | Identical |
| EN 60749-35:2006 | Identical |
| I.S. EN 60749-35:2006 | Identical |
| IEC 60749-35:2006 | Identical |
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