DIN EN 61188-1-2:1999-03

INTRODUCTION
1 Scope
2 Normative references
3 Engineering design overview
    3.1 Device selection
    3.2 Intraconnection
    3.3 Printed board and printed board assemblies
    3.4 Performance requirements
    3.5 Power distribution
4 Design of controlled impedance circuits
    4.1 Configurations
    4.2 Equations
    4.3 Controlled impedance design rules
    4.4 Cross-talk rules
    4.5 Coupon design rules
    4.6 Decoupling/capacitor rules
5 Design for manufacturing
    5.1 Process rules in CAD
    5.2 Design complexity and correlation to cost
6 Data description
    6.1 Details of construction
    6.2 Isolation of data by net class (noise, timing,
          capacitance and impedance)
    6.3 Electrical performance
7 Material
    7.1 Resin systems
    7.2 Reinforcements
    7.3 Prepregs, bonding layers and adhesives
    7.4 Frequency dependence
8 Fabrication
    8.1 General
    8.2 Preproduction processes
    8.3 Production processes
    8.4 Impact of defects at high frequencies
    8.5 Data description
9 Time domain reflectometry (TDR) testing
    9.1 Rationale
Annex A Units, symbols and terminology
Annex ZA Normative references to international publications
          with their corresponding European publications

Intended for use by circuit designers, packaging engineers, printed board manufacturers and procurement personnel in order that all may have a common understanding of each area. Intended to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are specified as designs where the interconnecting properties affect circuit performance and need unique considerations.