DIN EN 61188-5-4:2008-07
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
Hardcopy , PDF
German
01-01-2008
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INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Packaging
3.4 Process considerations
4 Small outlined J packages (SOJ)
4.1 Component description
4.2 Component dimensions
4.3 Solder joint fillet design
4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Bibliography
Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 61188-5-4:2007 | Identical |
| I.S. EN 61188-5-4:2007 | Identical |
| IEC 61188-5-4:2007 | Identical |
| EN 61188-5-4 : 2007 | Identical |
| NF EN 61188-5-4 : 2016 | Identical |
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