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  • VDE 0468-2-69 : 2018

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)

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    Superseded date:  12-03-2020

    Language(s): 

    Published date:  18-11-2014

    Publisher:  Verband Deutscher Elektrotechniker

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    Document Type Standard
    Publisher Verband Deutscher Elektrotechniker
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    DIN EN 60068-2-2 : 1995 ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    DIN EN 60068-2-20:2009-02 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    VDE 0468-1 : 2015 Environmental testing Part 1: General and guidance (IEC 60068-1:2013)
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    VDE 0468-2-2 : 2008 ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    DIN EN 60068-1 : 2015 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    DIN EN 61190-1-3:2015-05 (Draft) ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    DIN EN 60068-2-66:1995-06 ENVIRONMENTAL TESTING - TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR)
    EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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