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EN 100015-1 : 1992

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BASIC SPECIFICATION: PROTECTION OF ELECTROSTATIC SENSITIVE DEVICES - GENERAL REQUIREMENTS

Superseded date

01-02-2001

Published date

12-01-2013

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Foreword
Preface
Section one. General
1. General
1.1 Scope
1.2 Definitions
Section two. Design consideration to minimize the
effects of ESD
2. Design
2.1 Identification
2.2 Design of electrostatic discharge sensitive
      devices (ESDS)
2.3 Design of assemblies
2.4 Packaging design
2.5 System design
2.6 Design evaluation procedure
Section three. Labels signs and marking
3.1 Labels
3.2 Signs for ESD protected area (EPA)
3.3 Marking of earth bonding points, earth grounding
      points and ESD earth facilities
3.4 Marking of documentation
Section four. ESD Protected Area (EPA)
4.1 Configuration
4.2 Control boundaries
4.3 Basic material requirements for use within the
      controlled boundaries of all forms of ESD Protected
      Area (EPA)
4.4 Ionization
4.5 Humidity
4.6 Construction of the ESD protected area (EPA)
4.7 Field work
4.8 Tools
4.9 Fittings
4.10 Test and process equipment
4.11 EPA working practice
Section five. Protective packaging marking and
identification for ESDS
5.1 Packaging materials
5.2 Intimate packaging materials
5.3 Proximity packaging material
5.4 Secondary packaging material
5.5 Marking and identification
5.6 Package/component compatibility
Section six. Purchase, receipt, storage and handling
6.1 General
6.2 Purchase
6.3 Receipt
6.4 Unpacking within an EPA
6.5 Goods inward inspection
6.6 Movement and handling
Section seven. Training
Section eight. Quality responsibilities
8.1 Personnel responsibilities
8.2 Local co-ordinator
8.3 Selection of ESD materials
8.4 Procurement of ESDS components and subcontracted
      work
8.6 Design
8.7 Checking of electrostatic precautions
8.8 Frequent checks
8.9 Daily checks
8.10 Weekly checks
8.11 Monthly checks
8.12 Six monthly
Section nine. Periodic audit instructions
9. Periodic audit instructions
Annexes
A. Test procedure
A.1 Surface resistivity and resistance to ground
A.2 Charge decay
A.3 Measurement of antistatic properties
A.4 Additional tests
A.5 Measurement of relative humidity
Figures
1A. ESDS basic symbol
1B. ESDS simplified symbol
2. Warning label for ESDS
3. Warning sign for ESD protected area
4. Examples of ESD earth facility labels
5. Examples of earth bonding point labels
6. Examples of earth grounding point labels
7. Schematic of typical EPA
8. Example of an EPA showing typical facilities
9. Fieldwork implementation of EPA
10. Fieldwork implementation of EPA with bench
A.1 Charge measuring equipment
A.2 Capacitive sensor
A.3 Electrostatic shielding test equipment
Tables
1. User guide chart resistance, resistivity and charge
      decay in ESD protected areas
2. User guide chart for packaging materials
3. Suggested format for report (front sheet)
4. Suggested format for report (continuation sheet)

Describes the general requirements for the protection of electrostatic discharge sensitive devices from electrostatic discharges and fields. Applies only to electronic devices and assemblies. For areas with exposed conductors at potentials greater than 1,25 kV a.c. or 2,5 kV d.c., additional requirements specified in CECC 00015: Part 4 shall apply. Does not include requirements for personal safety but relevant local statutory requirements regarding health and safety of all persons in all places of work must be complied with. (Electrical potentials in excess of 50 V a.c. or 120 V d.c. may be dangerous to personnel.)

Committee
SR 101
DevelopmentNote
Supersedes CECC 00015. (01/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

01/206130 DC : DRAFT AUG 2001 IEC 62258 - SEMICONDUCTOR DIE PRODUCTS - MINIMUM REQUIREMENTS FOR PROCUREMENT AND USE - PART 1: GENERAL REQUIREMENTS - MECHANICAL, MATERIAL AND CONNECTIVITY
BS EN 160200-1:1998 Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality Capability approval procedure
FD ETR 127 : 95 FD EQUIPMENT ENGINEERING (EE) - ELECTROSTATIC ENVIRONMENT AND MITIGATION MEASURES FOR PUBLIC TELECOMMUNICATIONS NETWORK (PTN)
ES 59008-2 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY
EN 50390:2004 Space product assurance - The manual soldering of high-reliability electrical connections
I.S. EN 160200-1:1998 MICROWAVE MODULAR ELECTRONIC UNITS OF ASSESSED QUALITY - PART 1: CAPABILITY APPROVAL PROCEDURE (SECTIONAL SPECIFICATION)
ETR 127 : 20001 EQUIPMENT ENGINEERING (EE) - ELECTROSTATIC ENVIRONMENT AND MITIGATION MEASURES FOR PUBLIC TELECOMMUNICATIONS NETWORK (PTN)
02/709371 DC : DRAFT JULY 2002 EN 50390 - SPACE PRODUCT ASSURANCE - THE MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS
I.S. EN 61340-5-2:1999 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
BS EN 61340-5-2:2001 Electrostatics. Protection of electronic devices from electrostatic phenomena User guide
EIA 4899 : 2001 STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC 62239 : 2001 ELECTRONIC COMPONENT MANAGEMENT PLANS
IEC PAS 62239:2001 Electronic component management plans
BS EN 50390:2004 Space product assurance. The manual soldering of high-reliability electrical connections
EN 160200-1 : 1997 MICROWAVE MODULAR ELECTRONIC UNITS OF ASSESSED QUALITY - PART 1: CAPABILITY APPROVAL PROCEDURE (SECTIONAL SPECIFICATION)
EN 61340-5-2:2001/corrigendum:2001 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE

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